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371542-B21 - HP Intel Xeon 3.0GHz 1MB L2 Cache 800MHz FSB 604-Pin Micro-Fcpga Socket 90nm Processor Kit for ProLiant ML150 G2 Servers
371542-B21 - HP Intel Xeon 3.0GHz 1MB L2 Cache 800MHz FSB 604-Pin Micro-Fcpga Socket 90nm Processor Kit for ProLiant ML150 G2 Servers
Mfr Part#:
Availabilty: In stock
Condition:
Refurbished
Manufacturer:
HP
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ContactHP Intel Xeon 3.0GHz processor 3 GHz 1 MB L2
Intel Xeon 3.00 GHz, 1MB Cache, 800 MHz FSB
- Intel® Xeon® 3 GHz
- 1 MB L2 Socket 604 (mPGA604)
- Processor cores: 1 90 nm 103 W
About HP Intel Xeon 3.0GHz, Intel® Xeon®, Socket 604 (mPGA604), 90 nm, 3 GHz, Server/workstation, 1 MB
HP Intel Xeon 3.0GHz. Processor family: Intel® Xeon®, Processor socket: Socket 604 (mPGA604), Processor lithography: 90 nm. Market segment: Server, Number of Processing Die Transistors: 125 M, Processing Die size: 112 mm²
Maximize Performance. Minimize Power. Automatically.As data centers reach the upper limits of their power and cooling capacity, efficiency has become the focus of extending the life of existing data centers and designing new ones. As part of these efforts, IT needs to refresh existing infrastructure with standard enterprise servers that deliver more performance and scalability, more efficiently.
Customer Questions
Overview
Condition:
Refurbished
Manufacturer:
HP
Stock:
In Stock
Processor
Processor base frequency
3 GHz
Processor family
Intel® Xeon®
Processor cores
1
Processor socket
Socket 604 (mPGA604)
Component for
Server/workstation
Processor lithography
90 nm
Processor cache
1 MB
Processor cache type
L2
Processor front side bus
800 MHz
Thermal Design Power (TDP)
103 W
VID Voltage Range
1.25 - 1.4 V
Graphics
On-board graphics card
No
Features
Market segment
Server
Number of Processing Die Transistors
125 M
Processing Die size
112 mm²
Operational conditions
Tcase
72 °C
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