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417770-B21 - HP 1.60GHz 1066MHz FSB 4MB L2 Cache Socket LGA771 Intel Xeon 5110 Dual-Core Processor for ProLiant DL140 G3 Server
417770-B21 - HP 1.60GHz 1066MHz FSB 4MB L2 Cache Socket LGA771 Intel Xeon 5110 Dual-Core Processor for ProLiant DL140 G3 Server
Mfr Part#:
Availabilty: In stock
Condition:
New
Manufacturer:
HP
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ContactHP Intel Xeon 5110 processor 1.6 GHz 4 MB L2
Intel Xeon 5110 (4M Cache, 1.60 GHz, 1066 MHz FSB), 64-bit, 65nm, 65W, LGA771
- Intel® Xeon® 5000 Sequence 5110 1.6 GHz
- 4 MB L2 Socket 754
- Processor cores: 2 65 nm 64-bit 65 W
About HP Intel Xeon 5110, Intel® Xeon® 5000 Sequence, Socket 754, 65 nm, 1.6 GHz, 64-bit, Server/workstation
HP Intel Xeon 5110. Processor family: Intel® Xeon® 5000 Sequence, Processor socket: Socket 754, Processor lithography: 65 nm. Market segment: Server, Number of Processing Die Transistors: 291 M, Processing Die size: 143 mm². Processor package size: 37.5 mm. Intel® Virtualization Technology (Intel® VT): VT-x
The Intel® Xeon® processor 5 family can boost server performance by up to 80% over previous-generation Intel® Xeon® processor–based servers.Intel® Integrated I/O on the Intel® Xeon® processor 5 family accelerates data availability to the processing cores, reducing latency by up to 30%.
Intel® Xeon® processor 5 family processors intelligently deliver up to 70% more performance per watt, increasing computing power while maintaining maximum energy efficiency.
Customer Questions
Overview
Condition:
New
Manufacturer:
HP
Stock:
In Stock
Processor
Processor model
5110
Processor base frequency
1.6 GHz
Processor family
Intel® Xeon® 5000 Sequence
Processor cores
2
Processor socket
Socket 754
Component for
Server/workstation
Processor lithography
65 nm
Processor operating modes
64-bit
Processor cache
4 MB
Processor cache type
L2
Processor front side bus
1066 MHz
Thermal Design Power (TDP)
65 W
VID Voltage Range
1 - 1.5 V
FSB Parity
Yes
CPU multiplier (bus/core ratio)
6
Graphics
On-board graphics card
No
Features
Execute Disable Bit
Yes
Idle States
Yes
Thermal Monitoring Technologies
Yes
Market segment
Server
Number of Processing Die Transistors
291 M
Processing Die size
143 mm²
Processor special features
Enhanced Intel SpeedStep Technology
Yes
Intel Virtualization Technology (VT-x)
Yes
Operational conditions
Tcase
65 °C
Weight & dimensions
Processor package size
37.5 mm
Other features
Intel® Virtualization Technology (Intel® VT)
VT-x
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