LB208AV - HP 3.46GHz 6.40GT/s QPI 12MB L3 Cache Socket LGA1366 Intel Xeon X5690 6-Core Processor Upgrade

Mfr Part#:
Availability:
In stock
HP
Manufacturer: HP
$156.03

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Overview

HP X5690 processor 3.46 GHz 12 MB L3

Intel Xeon X5690 (12M Cache, 3.46 GHz, 6.40 GT/s Intel QPI), L3 Cache 12MB, 32 nm

  • Intel® Xeon® 5000 Sequence X5690 3.46 GHz
  • 12 MB L3 Socket B (LGA 1366)
  • Processor cores: 6 32 nm 64-bit 130 W
  • Maximum internal memory supported by processor: 288 GB

Description

About HP X5690, Intel® Xeon® 5000 Sequence, Socket B (LGA 1366), 32 nm, X5690, 3.46 GHz, 64-bit

HP X5690. Processor family: Intel® Xeon® 5000 Sequence, Processor socket: Socket B (LGA 1366), Processor lithography: 32 nm. Memory channels: Triple-channel, Maximum internal memory supported by processor: 288 GB, Memory clock speeds supported by processor: 800,1066,1333 MHz. Market segment: Server. Width: 45 mm, Height: 42.5 mm

Designed for industry-leading performance and maximum energy efficiency, these versatile 1-way and 2-way 64-bit multi-core servers and workstations are ideally suited to a wide range of infrastructure, cloud, high-density, and high performance computing (HPC) applications.

Features and benefits of the Intel® Xeon® processor 5600 series

Intelligent performance
Boost performance by up to 15 times over single-core servers with processors that intelligently adapt to your workload.

Intel® Turbo Boost Technology
Dynamically and automatically maximizes server application performance by increasing core frequencies, enabling faster speeds for specific threads, and mega-tasking workloads.

Intel® QuickPath Technology
Scalable shared memory architecture with high-speed, point-to-point processor interconnects, plus larger caches and larger memory for two-processor servers.

Large memory capacity
Up to 18 DIMM slots with up to 144 GB of main memory and up to 12 DIMM slots with up to 192 GB of memory support higher performance for your data intensive applications.

8 MB shared L3 cache with enhanced smart cache
Inclusive shared L3 cache increases application performance by reducing traffic to the processor cores.

Intel® I/O Acceleration Technology (Intel® I/OAT), with Intel® QuickData Technology
Moves data more efficiently through Intel® Xeon® processor-based workstations and server platforms for fast, scalable, and reliable network performance.

AES new instructions
Delivers robust encryption without needing additional appliances or increased performance overhead, improving CPU performance for encryption.

Automated energy efficiency
Get 45 percent more performance? than previous generations without increasing power consumption with servers based on next-generation 32nm process technology.

Integrated power gates
Allow idling cores to be reduced to near-zero power, independent of other cores, reducing server idle power consumption.

Automated low-power states
Automatically put processor, memory, and I/O controller into the lowest available power states that will meet the current workload while minimizing performance impact.

Flexible virtualization
Combine servers from multiple generations into the same virtualized server pool to extend failover, load balancing, and disaster recovery capability.

Intel® Virtualization Technology? (Intel® VT)
- Enables more operating systems and software to run in today’s virtual environments;
- Developed with virtualization software providers to enable greater functionality and compatibility compared to non-hardware-assisted virtual environments;
- Get the performance and headroom to improve the average virtualization performance over previous generations of two-processor servers.

Specification

Overview
Condition:
Refurbished
Manufacturer:
HP
Stock:
In Stock.
Stock updated on:
2023-12-24
Processor
Processor model
X5690
Processor base frequency
3.46 GHz
Processor family
Intel® Xeon® 5000 Sequence
Processor cores
6
Processor socket
Socket B (LGA 1366)
Component for
Server/workstation
Processor lithography
32 nm
Processor threads
12
System bus rate
6.4 GT/s
Processor operating modes
64-bit
Processor boost frequency
3.73 GHz
Processor cache
12 MB
Processor cache type
L3
Thermal Design Power (TDP)
130 W
Box
No
VID Voltage Range
0.750 - 1.350 V
CPU multiplier (bus/core ratio)
26
Memory bandwidth supported by processor (max)
32 GB/s
Memory
Maximum internal memory supported by processor
288 GB
Memory clock speeds supported by processor
800,1066,1333 MHz
Memory channels
Triple-channel
Features
Market segment
Server
Operational conditions
Maximum operating temperature
78.5 °C
Weight & dimensions
Width
45 mm
Height
42.5 mm

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