CM8064401736303 - Intel Xeon E5-1607 v3 Quad Core 3.10GHz 5.00GT/s DMI 10MB L3 Cache Socket FCLGA2011-3 Processor
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Intel Xeon E5-1607V3 processor 3.1 GHz 10 MB Smart Cache
Intel® Xeon® Processor E5-1607 v3
(10M Cache, 3.10 GHz)
- Intel Xeon E5 v3 E5-1607V3 3.1 GHz
- 10 MB Smart Cache LGA 2011-v3
- Processor cores: 4 22 nm 64-bit 140 W
- Maximum internal memory supported by processor: 768 GB DDR4-SDRAM
About Intel Xeon E5-1607V3, Intel Xeon E5 v3, LGA 2011-v3, 22 nm, Intel, E5-1607V3, 3.1 GHz
Intel Xeon E5-1607V3. Processor family: Intel Xeon E5 v3, Processor socket: LGA 2011-v3, Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: x4, x8, x16, Supported instruction sets: AVX 2.0. Processor package size: 52.5mm x 45mm. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x, Maximum internal memory: 768 GB, Maximum internal memory: 786432 MB
Intel® 64Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software. Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.
Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.


















